SpeedPox® Protex
Advanced 1K high-performance epoxy systems designed for potting and encapsulation applications, such as transformers, filters, capacitors, coils, and many more. Our solvent-free, optionally filled formulations offer excellent thermal shock resistance, mechanical properties and dielectric performance.
With no pot life constraints, they fully cure within seconds, ensuring rapid and efficient processing - ideal for demanding environments like electrical systems.
Cost Savings
curing process reduces time & energy demands by up to 99%
Adaptable
Integrates into existing processes, compatibility with heat and UV light
Curing-on-demand
our patented instant curing technology is curing within seconds
unlimited pot-life
Reuse of uncured resins possible
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How SpeedPox® epoxy resins can be used in electronic applications
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Curing of shadow-areas is possible
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Strong adhesion on wide range of substances
optional turn-dark feature protects sensitive components
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Waterproofing electrical component
SpeedPox® Protex
ready-made solutions
An encapsulation material or adhesive for protecting electronic components adheres well to various substrates and cures even without direct UV light exposure, ensuring reliable protection and performance.
- Can be adjusted to individual needs
- More materials are available on request
Time and energy savings, up to 99%
No more mixing, No more post-curing
Curing in shadow areas possible on wide wavelength range
Low viscosity
Instant curing technology
Unfilled low viscosity transparent epoxy that turns black upon UV curing, designed with a curing wave mechanism for complete curing even in shadowed areas.
- Can be adjusted to individual needs
- More materials are available on request
Time and energy savings, up to 99%
No more mixing, No more post-curing
Curing in shadow areas possible on wide wavelength range
Long pot life at room temperature
Electro potting compound for secure encapsulation in electronic applications, featuring high viscosity, thermal stability, strong mechanical and dielectric properties, and flame-retardant formulation for reliable protection.
- Can be adjusted to individual needs
- More materials are available on request
No more mixing, No more post-curing
Instant curing technology
Long pot life at room temperature
Good mechanical properties
High temperature stability
Unfilled material, transparent, fast-curing, one-component epoxy resin developed for glob top protection of electronic components.
- Can be adjusted to individual needs
- More materials are available on request
Time and energy savings, up to 99%
No more mixing, No more post-curing
Globe-top protection
Strong adhesion on several substrates
Long pot life at room temperature
Electro potting compound for oven curing, but also UV curing under specific conditions and substrates, flame retardant
- Can be adjusted to individual needs
- More materials are available on request
Instant curing technology
Time and energy savings, up to 99%
No more mixing, No more post-curing
Good mechanical properties
High temperature stability
High-performance UV-curing encapsulation system for protecting electronic components, offering strong mechanical integrity, excellent dielectric properties, and flame-retardant formulation for high temperature stability.
- Can be adjusted to individual needs
- More materials are available on request
No more mixing, No more post-curing
Instant curing technology
Time and energy savings, up to 99%
Curing in shadow areas possible on wide wavelength range
Dual-curing material
Designed for the protection of electronic components, low viscosity when heated up, stable at high temperatures, has good mechanical and dielectric properties, low water absorption, flame retardant.
- Can be adjusted to individual needs
- More materials are available on request
No more mixing, No more post-curing
Instant curing technology
Time and energy savings, up to 99%
Curing in shadow areas possible on wide wavelength range
Dual-curing material
Designed for protecting printed circuits and electronic components, suitable for thin layer application via screen printing, appearing pink in bulk but becoming transparent when cured.
- Can be adjusted to individual needs
- More materials are available on request
Time and energy savings, up to 99%
Transparent
No more mixing, No more post-curing
Low viscosity
High flexibility
Oven-curing electro-potting compound for secure encapsulation in electronic applications, featuring high flexibility, elongation, and reliable protection, ideal for durable and precise electronic casting applications
- Can be adjusted to individual needs
- More materials are available on request
High deformation flexibility
Time and energy savings, up to 99%
No more mixing, No more post-curing
Instant curing technology
Long pot life at room temperature
A high-strength casting system designed for oven curing in potentially explosive environments.
- Can be adjusted to individual needs
- More materials are available on request
No more mixing, No more post-curing
Strong adhesion on several substrates
Highly conductive
Good mechanical properties
High temperature stability
Ultra-fast curing potting compound with exceptional electrical insulation, temperature stability, abrasion resistance and fire-retardant
- Can be adjusted to individual needs
- More materials are available on request
Time and energy savings, up to 99%
No more mixing, No more post-curing
Instant curing technology
High temperature stability
Long pot life at room temperature
„Mit SpeedPox sehen wir Flächeneinsparungen von bis zu 45%, sowie Energieseinsparungen vonbis zu 60% als realistisch umsetzbar!“
Explore other
innovative solutions
Explore our diverse range of innovative, ready-to-use product lines.
Our SpeedPox® technology can be applied to all epoxy-based materials.
Talk with our expert to find the perfect product and improve your process
SpeedPox® technology can be applied to all epoxy-based materials. We provide tailored solutions for your specific requirements, improving current workflows, or adjusting previously used epoxies.
