SpeedPox® Connex
Electrically conductive adhesives exhibit excellent coherence to all metal substrates and possess adaptive conductivity properties.
Ultra-fast UV curing
conductive adhesives with instant curing technology (<5s)
High-temperature stability
no risk of damaging sensitive components through heat
Curing-on-demand
no processing risks (e.g. with dispensing)
Cost & waste savings
Reuse of uncured resins possible
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How SpeedPox® epoxy resins can be used in electronic applications
RFID antenna for IoT applications
SMD assembly: pick and place the smd components
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Bonding of LED chipS to A power module using ECA
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Local protection of electronic components
SpeedPox® Connex
ready-made solutions
High-performance adhesive for excellent conductivity and fast heat curing, ideal for SMD assembly in IoT applications.
- Can be adjusted to individual needs
- More materials are available on request
Enables UV curing of ECA
Instant curing technology
Highly conductive
Strong adhesion on several substrates
Silver-based conductive adhesive paste for bonding SMD electronic components to printed circuit boards, flexible circuits, and other applications.
- Can be adjusted to individual needs
- More materials are available on request
Enables UV curing of ECA
High temperature stability
Highly conductive
Instant curing technology
Silver-based conductive adhesive paste for bonding SMD components to printed flexible circuits and conventional circuit boards.
- Can be adjusted to individual needs
- More materials are available on request
Enables UV curing of ECA
Highly conductive
Long pot life at room temperature
Instant curing technology
Carbon adhesive with stable resistance ranging from 100 Ω to 100KΩ. Can be used as a replacement to the resistor.
- Can be adjusted to individual needs
- Available for dispensing, screen and stencil printing
- More materials are available on request
Enables UV curing of ECA
Good mechanical properties
Long pot life at room temperature
Instant curing technology
High-conductivity adhesive for printed electronics, ensuring optimal adhesion on substrates like PET, PC, aluminum, and steel.
- Can be adjusted to individual needs
- More materials are available on request
Enables UV curing of ECA
Instant curing technology
High temperature stability
Good mechanical properties
Long pot life at room temperature
Carbon-based conductive adhesive paste for printed electronics, high conductivity and optimal adhesion on substrates like PET, PC, aluminum, and steel.
- Ideal for stencil printing
- Can be adjusted to individual needs
- More materials are available on request
Enables UV curing of ECA
Good mechanical properties
Instant curing technology
Strong adhesion on several substrates
Ideal for SMD component bonding and stencil printing, compatible with various substrates like PET, PC, aluminum, and steel, offering enhanced conductivity and excellent adhesion.
- Can be adjusted to individual needs
- More materials are available on request
Enables UV curing of ECA
Long pot life at room temperature
High temperature stability
Good mechanical properties
silver-filled adhesive paste, providing excellent conductivity and durable adhesion for bonding SMD components to PCBs and flexible circuits, excellent adhesion, PET, PC, aluminum, and steel.
- Can be adjusted to individual needs
- Available for dispensing, screen and stencil printing.
- More materials are available on request
Enables UV curing of ECA
Good mechanical properties
Instant curing technology
Strong adhesion on several substrates
Long pot life at room temperature
„Mit SpeedPox sehen wir Flächeneinsparungen von bis zu 45%, sowie Energieseinsparungen vonbis zu 60% als realistisch umsetzbar!“
Explore other
innovative solutions
Explore our diverse range of innovative, ready-to-use product lines.
Our SpeedPox® technology can be applied to all epoxy-based materials.
Talk with our expert to find the perfect product and improve your process
SpeedPox® technology can be applied to all epoxy-based materials. We provide tailored solutions for your specific requirements, improving current workflows, or adjusting previously used epoxies.
